Z-PACK HM-ZD & Z-PACK HM-ZD+
Z-PACK HM-Zd & Hm-Zd Plus CONNECTOR

6469002-1(MALE)、6469001-1(FEMALE)

Z-PACK HM-Zd & Hm-Zd Plus CONNECTOR

Description

Z-PACK HM-Zd connectors are one of the hottest high-speed, differential, board to backplane electrical connectors to hit the telecommunications and computer industries. It's an extension of the already established IEC 61076-4-101, Hard Metric connector family, however HM-Zd provides a differential solution for applications up to 12.5 gigabits/second.

Our XAUI HM-Zd Interoperability Platform is a common platform for interoperability testing supported by members of the 10 GEA XAUI Interoperability Group and the 10 Gigabit Ethernet Consortium. HM-Zd has also been chosen as the backplane interconnect for the PICMG 3.x (ATCA) industry standard, driven toward dramatically improving and simplifying the routing of electronic interconnects.

Upgrading current backplane architectures from existing to higher performance designs is a continual challenge in the interconnect industry. We are addressing this issue with its Z-PACK HM-Zd connector family with the introduction of the Z-PACK HM-Zd Plus connector. The new Z-PACK HM-Zd Plus product is ideally suited to meet next generation AdvancedTCA designs.
The Z-PACK HM-Zd Plus connector is fully compatible with existing Z-PACK HM-Zd connectors, but offers an increase in data rate performance to 15 - 20 Gb/s. Enabling this performance upgrade are a reduction in connector and pcb footprint crosstalk, tighter impedance control, reduction of intra pair skew and an improvement in the insertion loss characteristics. All of this is achieved in a form factor that is identical to the current industry standard version and therefore fully backward compatible with existing legacy equipment in the field today.

As exemplified by the Z-PACK HM-Zd Plus connector development effort, we are committed to meeting customer needs as requirements for increased interconnect performance intensify, not only with brand new, state-of-the-art designs but with enhanced versions of existing connector families as well.



Applications
Z-PACK HM-Zd Plus connectors are designed for high speed backplane applications:

Servers: Blade, Rack Mount and Mainframe
Switches: Stackable, Carrier Grade, Core, Edge and Metro Ethernet
Routers: Edge, Core, Enterprise Class, Carrier Grade Ethernet, Broadband Remote access Aggregation Server (BRAS), and Multi Service Edge
Optical Transport: Carrier Grade Optical, Metro Wave Division Multi-plexing (WDM), Optical Multi-Service Provisioning, Long Haul Optical, and Optical Line Terminals (OLT) ernet
Z-PACK HM-Zd & Hm-Zd Plus CONNECTOR (80 KB)
Features
Up to 12.5 Gb/s performance
Density up to 16 differential pairs per cm (40 DP per inch), in 25.4 mm (1"") slot-pitch
Available in 2, 3 and 4 pairs/column, fitting 20.32 mm (0.8"") slot-pitch for2 and 3 pair version and 25.4 mm (1"") slot-pitch for the 4 pair version
HM-Zd Plus provides enhanced signal integrity in a design backwards compatible with standard HM-Zd
Advanced Differential Fabric (ADF) Connector specified in the PICMG 3.X
Advanced TCA specifications
Specification
15 - 20 Gb/s performance
Fully plug compatible with current Z-PACK HM-Zd backplane connector configurations
Connector upgrade including reduced crosstalk and skew, tighter impedance control, and improved signal throughput
Ideal for next generation AdvancedTCA designs
PCB footprint enhanced for lower crosstalk and improved impedance while permitting easier trace routing
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