IMPACT
IMPACT CONNECTOR

2007777-1(MALE)、 2007703-1(FEMALE)

IMPACT CONNECTOR

Description

Our new Impact™ backplane connector system is designed for increased speed and density to meet the future system upgrades and next generation requirements of data networking and telecommunications equipment. The Impact backplane system also offers our customers a value added approach of speed, density, cost and long term reliability.

The Impact connector design system contains a unique broad-edge coupled design which utilizes low impedance, localized ground return path in an optimized differential pair array. Additionally, differential pairs are tightly coupled and surrounded by ground structures to isolate the pairs, which in turn reduces crosstalk and increases overall bandwidth performance with minimal performance variance.

Backplane header construction on the Impact connector offers air pockets selectively placed in the header floor to isolate signal pairs. The header signal pins are straight with no forms or offsets, which increase the mechanical strength of the pins. The mating interface features a bifurcated beam with two points of contact with the second staggered 1 mm behind the first for maximum reliability.



Applications
The Impact connector system is ideal for high speed, backplane applications including: Switches
Servers/Blade Servers
Routers
Storage
IMPACT CONNECTOR (405 KB)
IMPACT CONNECTOR (152 KB)
Features
Up to 25 Gb/s performance
Density up to 32 high speed differential pairs per cm (80 DP per inch)
100 Ohm
Modular system: 2, 3, 4, 5, 6 pair/ column available. 6 through 20 columns offered in increments of 2 columns
Specification
25 Gb/s performance
100 and 85 Ohm Impedance
PCB footprint available in two options for both backplane and daughtercard connectors:
Option 1: 0.46 mm (.018"") PTH
Option 2: 0.39 mm (.0154"") PTHRobust daughtercard connector design to withstand connector insertion forces into PCB
Built in guidance available for improved mating alignment and to maximize available PCB real estate
Loading...