Z-PACK TINMAN & Z-PACK TINMAN+
Z-PACK TinMan 100 Ω和 85 Ω CONNECTOR

1934269-1(MALE)、 1934218-1(FEMALE)

Z-PACK TinMan 100 Ω和 85 Ω CONNECTOR

Description

Increasing system performance is a continuous challenge within the interconnection channel. One design approach gaining momentum in the industry is the reduction of the system characteristic impedance from 100 ohm to 85 ohm. Such a reduction of impedance from 100 ohm to 85 ohm can improve overall system performance by incorporating thinner PC boards, increasing density with same board thickness and making it easier to match the system impedance to the connector footprint impedance. We are leading the way in providing a complete interconnect solution for this emerging market. The new suite of Z-PACK TinMan 85 ohm connectors provides the same industry leading performance and features and benefits designed into the standard 100 ohm Z-PACK TinMan connector system but in an 85 ohm impedance package. This connector was designed to provide 85 ohm nominal characteristic impedance through the entire connector, from PCB footprint to PCB footprint. TE Connectivity and ©Intel Corporation are in evaluation phase of 85 Ohm Z-PACK TinMan connector for Intel® QuickPath Interconnect (QPI) connector development.
  • QPI Technology
  • Intel® QuickPath Interconnect (QPI) Connector Development
  • As part of the complete Z-PACK TinMan connector product family, the 85 ohm version offers fully protected right-angle and vertical receptacles for use on daughtercards and mezzanine boards where handling damage can be a concern when plugging to a mating header. Ground contacts strategically positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan 85 ohm connector to achieve low crosstalk and high through-put performance levels. A dual point of contact mating interface and compliant pin interface to printed circuit board help assure reliability.
    Applications
    Servers (Blade & Rack Mount) The Z-PACK TinMan 85 Ohm connector family is designed for the cost pressured, high performance, high signal density, Blade and Rack Mount Server applications implementing an 85 Ohm system impedance.
    Z-PACK TinMan 100 Ω和 85 Ω CONNECTOR (89 KB)
    Features
    Up to 12.5 Gb/s performance
    Density up to 14 high speed differential pairs per cm (80 DP per inch); 6-16 columns available
    Modular system: 3, 4, 5, and 6 pair/column, respectively fitting 16.25mm (.625""), 20.32 mm (0.8"") and 25.4 mm (1"") slot-pitch
    85 ohm impedance version for QPCle and Intel QPI standards, and other 85 ohm system applications
    Specification
    10+ Gb/s performance
    85 ohm characteristic impedance for differential pair configuration
    5 pair module offers 26 pairs/10mm [66 diff. pairs/inch] fitting within a 25.40 [1.00] card slot pitch
    3 pair module offers 16 pairs/10mm [40 diff. pairs/inch] fitting within a 16.25 [.640] card slot pitch
    Configurations will be available in right angle and vertical pin headers and right angle and vertical receptacles
    Reliable, redundant contact design on every signal contact
    Modular system offered in various column modules
    Meets Industry reliability requirements of Telcordia
    Sequencing for ground and signal contacts
    RoHS Compliant
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