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MINIPAK & MINIPAK HD
The MINIPAK HDL connector combines a high density power interface into a blind-mateable board-to-board connector, which stands only 8mm off the edge of the printed circuit board.
Features
High density, low profile, power/signal, blind-mate connector
Developed to meet next generation 1u application by reducing airflow impedance
Design is customizable
Serves both solder reflow and press fit applications with the same contact
Gatherability - +/- 2mm
Mating Forces of 1 ½ N maximum per power contact
Single piece molded housing for best strength and alignment
Durability - 250 mating cycles
Wipe - Minimum of 2.5mm on shortest signal
Three levels of sequencing
Developed to meet next generation 1u application by reducing airflow impedance
Design is customizable
Serves both solder reflow and press fit applications with the same contact
Gatherability - +/- 2mm
Mating Forces of 1 ½ N maximum per power contact
Single piece molded housing for best strength and alignment
Durability - 250 mating cycles
Wipe - Minimum of 2.5mm on shortest signal
Three levels of sequencing
Specification